Increasing demands for higher IP protection classes ensure that electronic components are additionally protected. An excellent, highly advantageous solution is to injection mold with plastic around the parts.
Potential solutions are multi-layered and versatile, but more or less subject to constraints.
In any case, any solution will be extremely component-specific. Therefore the different possibilities have to be carefully thought-over, examined and coordinated at a very early stage. We work together with you as a partner to develop the special solution for your component.
Our many years of experience and expertise in our wide range of teams ensure you will find the solution for your special application.
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